Prof. Dr. Erdem Alaca

Building on the scaling paradigm established in integrated circuits, continued device miniaturization beyond MEMS addresses growing sensing demands in wearables, autonomous systems, and the Internet of Things. Silicon nanowires are particularly attractive transducers due to their high surface-to-volume ratio, strong electromechanical coupling, and CMOS compatibility, enabling enhanced sensitivity at reduced power consumption. However, scalable batch fabrication of multiscale, three-dimensional hybrid architectures remains a major challenge for semiconductor manufacturing. This work presents monolithic systems integration as a batch-compatible interface to the nanoscale, enabling substantial miniaturization and enhanced sensitivity in electromechanical sensor platforms operating across multiple scales and broad application potential.